Integrated GHz Ultrasonics: More Than Moore With Sonics
MTL Seminar Series
Amit Lal, Cornell University
Speaker
Abstract
GHz ultrasonics on CMOS chips are enabled by integration of fast, deep sub-micron transistors and GHz thin film piezoelectric transducers. Sonic wavelengths on the order of a few microns can generate wave packets with spatial extent that is less than the substrate thickness. Wave packet transport and sensing constitutes a new paradigm for signal processing for precision delays, analog computing, and biological sensing.
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